要是能把芯片做大点、光通量做上去点就好了。。。
用着7135感觉很不错，至少电池电压降低了可以发现。如果全程恒流的可能倒还不习惯
此时单个7135的热功率=（4.2-3.25）*0.35=0.3325W，看PDF似乎还不需要特意做散热PAD
原文说单个7135功率在0.7W以上是才需要额外的散热
=====================================
Thermal Consideration:
The maximum j ...
laomao0000 发表于 2010-6-11 16:23 http://www.shoudian.org/images/common/back.gif
0.3W的时候发热也相当厉害了，我用这个做了个台灯，7135上消耗的大概也是0.3W左右，感觉不要多长时间就很烫了。不过后来把它焊到个基板上再用螺丝拧到了散热片上面应该没有问题了
25mm²
字数补丁.EXE
太强了
看图，Vf=3.25V@2A,7135的效率=3.25/4.2=77.4%
似乎低于常见的降压DC-DC
laomao0000 发表于 2010-6-11 16:17 http://www.shoudian.org/images/common/back.gif
大哥电路效率=输出功率/输入功率=（输出电压X输出电流）/（输入电压X输入电流）7135输入输出电流是一样地 但18650电池2A负载后电压不可能还有4.2V所以效率应该是3.25V/负载后电池电压 肯定大于77.4%
至于7135地效率 早就已经有定论了 VF越低 7135恒流效果越好 但效率反而越低
又是流口水的东西
不知道SST的核心面积多大？
看来LED赶超HID的日子不远了。
可惜光通量密度下降了
SST90 封装上电参数：
色温6,500K，1,000 lm,3.2 A,
最大亮度2250 lm,9.0 A
单核，核心3mmx3mm ，9平方毫米
不知道CREE的XM-L的发光核心能比他能小多少？
就算是直径5mm的圆透镜内封个最大方形核心
估计也得有3*3mm了吧？？？貌似和SST核心大小也差不多
仅仅是电流比SST小了很多 只能搞到2A
哈哈看来7135又要卷土重来鸟
7135*N的电路要跟上啊
世界越来越BT罗 ，不过也是好事吧。
本帖最后由 toud 于 2010-6-11 22:43 编辑
就算是直径5mm的圆透镜内封个最大方形核心
估计也得有3*3mm了吧？？？貌似和SST核心大小也差不多
仅仅是电流比SST小了很多 只能搞到2A
xxc3235797 发表于 2010-6-11 22:04 http://www.shoudian.org/images/common/back.gif
http://www.candlepowerforums.com/vb/showthread.php?t=276322
不懂这里的鸟话，是说芯片是2*2mm吗?但3*3绝对不可能吧？透镜有很强的放大作用。
SST-90的陶瓷板为11*10mm,透镜直径8mm http://www.luminus.com/stuff/contentmgr/files/0/49fb13dd1ecd06ba454cc7714a96b032/miscdocs/pds_001342_rev_04_sst_90_w_product_datasheet_illumination.pdf，XM-L与其看起来芯片于陶瓷座比例接近，但透镜直径估计最大也就4.5mm吧，芯片怎能达到3*3mm?XM-L的透镜又不是平的。
本帖最后由 xxc3235797 于 2010-6-11 23:03 编辑
看来 比SST小不少哦
貌似是2*2mm的核心 不知道对不对？
我来替 探照灯兄 转运下 在座的兄弟 谁"E"文好 能不能帮忙代 译 一下
Preliminary overview of the Cree XLamp XM-L LED from general information released at Light Fair 2010.
The XM-L LED is built on the XP-C/E/G format style in a slightly larger size. The outside dimensions are
5.0 mm by 5.0 mm as apposed to the XP size of 4.0 mm by 4.0 mm. The die size is 2.0 mm by 2.0 mm
with 5 internal bars surrounded by a border in witch the bonding wires are attached. The XP-G has 4 bars
and the XP-C/E has 3 internal bars with the same border attachment points. The substrate thickness
should be the same as the smaller LEDs in the family.
Output is stated to be 160 Lumens at 350 mA current at 2.86 volts. And at 2 Amps the output is 750
Lumens at 3.4 volts or 110 Lumens per watt. Since the XP-G current was raised to 1.5 Amps from 1 Amp,
it will be safe to assume that the current input limit for the XM-L will be at least 2.5 Amps for an output
of 900 Lumens. Actual current limit may be slightly higher depending on the number and/or size of the
bonding wires. At 2 degrees C per watt the thermal efficiency is very good; however the power limit may
also be restricted by the very small footprint that concentrates the heat in a restricted area. Good
thermal management design of the flashlight heat sink will be required for higher outputs.
The output should work well with most solid optics and with reflectors that work with the XP-E/G LEDs,
the Seoul P4 and the older Lux III/K2 LEDs. The output angle will most likely be slightly greater than
that of the smaller die LEDs. The difference will be made up by the increased output of the XM-L vs.
that of the XP-G LED, so the throw may be the same with more side spill at the same drive levels. At
one Amp the output is 430 vs. 350 Lumens and at 1.5 Amps it is 610 vs. 460 Lumens.
大致我的理解是
XM 为5*5mm的封装面积 XP为4*4mm封装面积 XM的发光核心面积为2*2mm
XM的芯片为5块发光栅格 XP-G的芯片为4块发光栅格 XP-C/E的芯片为3块发光栅格
其他的九看不太明白了
2A 直趋爽啊～
2A 直趋爽啊～
淘汰MCE的？